Latest Qualcomm RB3 Gen 2 Developer Kit Unlocks AI Computing for IoT Edge Innovation

This is a sponsored article brought to you by Qualcomm.

In a move set to transform the Internet of Things (IoT) landscape, Qualcomm Technologies, Inc. has introduced its Qualcomm
RB3 Gen 2 developer kits, designed to put advanced AI edge computing power into the hands of developers everywhere. This kit is available as Qualcomm RB3 Gen 2, based on the Qualcomm QCS6490, or the Qualcomm RB3 Gen 2 Lite, based on the Qualcomm QCS5430.

Both QCS6490 and QCS5430 processors provide efficient, high-performance, AI enhanced solutions for applications in robotics, AI vision, industrial automation, retail, smart security, precision agriculture, smart metering, predictive maintenance and personal health. By empowering developers with robust tools for edge computing, Qualcomm Technologies is encouraging a broader range of innovators—from tech companies to startups and students—to bring cutting-edge IoT solutions to life.

Nadim Ferzli, Staff Manager, Product Marketing for Qualcomm Technologies, emphasized the importance of edge computing as a critical factor in the kit’s development. “AI-enabled edge computing has a lot of benefits, including faster response times, on-device decision making and enhanced security, as well as reduced cost,” Ferzli explained, noting that processing data locally enables faster decision-making and reduces dependency on cloud-based processing. This local computing power is essential for applications that require real-time responses like robotics, security and industrial automation.

“AI-enabled edge computing has a lot of benefits, including faster response times, on-device decision making and enhanced security, as well as reduced cost”
—Nadim Ferzli, Qualcomm Technologies

The Qualcomm RB3 Gen 2 Kits feature a modular design based on the 96Board compact, credit card- sized form factor and specifications. The kit includes numerous connection options, such as multiple USB, ethernet, camera, and display ports, as well as access to various GPIOs for low-speed communication protocols like SPI, UART, and I2C, and high-speed connections like PCIE, USB, and MIPI. The kits also come with Wi-Fi 6E, Bluetooth 5.2, and optional 5G connectivity through additional modules. Qualcomm Technologies has a
dedicated resource page detailing the hardware and connections. The kits can be expanded with the addition of mezzanine boards, keeping their compact size, which is beneficial for rapid prototyping and proof-of-concept projects where users can add their own attachments and integrate the kit into their preferred robot, camera, or other hardware platform. Qualcomm Technologies also provides a template that developers can take to quickly create their own mezzanine cards.

The Power of AI-Enhanced Edge Computing at the Core

Central to the appeal of the Qualcomm RB3 Gen 2 is the edge-focused approach. The QCS6490 and QCS5430 processors are engineered to handle substantial computing loads at the device level. Equipped with a…